Method of manufacturing an intermediate product for an interposer and intermediate product for an interposer

ABSTRACT

A method of manufacturing an intermediate product for an interposer including a glass substrate having a plurality of through holes is provided. The method includes a step of forming a resin layer on a support substrate, and a step of forming a laminated body by adhering the glass substrate having the plurality of through holes on the resin layer. The glass substrate having the plurality of through holes has a thickness within a range of 0.05 mm to 0.3 mm.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a continuation application filed under 35U.S.C. 111(a) claiming benefit under 35 U.S.C. 120 and 365(c) of PCTInternational Application No. PCT/JP2013/070934 filed on Aug. 1, 2013and designating the U.S., which claims priority to Japanese PatentApplication No. 2012-197743 filed on Sep. 7, 2012. The entire contentsof the foregoing applications are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an interposer and a method ofmanufacturing an interposer.

2. Description of the Related Art

In view of the demands for high integration and miniaturization ofsemiconductor devices in recent years, efforts are being made to furtherdevelop the so-called “semiconductor three-dimensional (3D) packagingtechnology” which involves three-dimensionally integrating a pluralityof LSI (large-scale integration) chips of a system into a singlepackage.

In the semiconductor 3D packaging technology, elements have to beelectrically interconnected three-dimensionally via fine conductivewiring patterns. However, it is difficult to form such fine wiringstructures using conventional techniques such as wire bonding. Thus, inthe semiconductor 3D packaging technology, a relay substrate having aplurality of via electrodes is used. Such a relay substrate is alsoreferred to as an interposer. By using one or more relay substrates, afine and complex three-dimensional conductive wiring pattern may beformed.

Such a relay substrate or interposer may be formed, for example, byforming a plurality of fine through holes in a glass substrate, andfilling the through holes with conductive material thereafter. Forexample, International Publication No. WO2010/087483 discloses atechnique that involves irradiating an excimer laser on a glasssubstrate to form a through hole.

A member for an interposer may be manufactured, for example, byirradiating an excimer laser on a glass substrate to form a through holetherein (hereinafter referred to as “glass substrate with throughholes”).

Typically, a glass substrate used for manufacturing an interposer isextremely thin (e.g. 0.1 mm) so that a through hole may be easily formedin the glass substrate.

When such a thin glass substrate is used to manufacture a “glasssubstrate with through holes,” the strength of the “glass substrate withthrough holes” may be reduced due to the presence of through holes. Forthis reason, cracks and defects may be created in the “glass substratewith through holes” upon transferring the “glass substrate with throughholes” for a next process and/or handling the “glass substrate withthrough holes” in various process steps, for example.

SUMMARY OF THE INVENTION

In view of the above, an aspect of the present invention relates toproviding a method of manufacturing an intermediate product for aninterposer that can reduce the risk of cracks and defects being createdin a glass substrate with through holes. Another aspect of the presentinvention relates to providing an intermediate product for an interposerwith a reduced risk of cracks and defects being formed in a glasssubstrate with through holes.

According to one aspect of the present invention, a method ofmanufacturing an intermediate product for an interposer including aglass substrate having a plurality of through holes is provided. Themethod includes a step of forming a resin layer on a support substrate,and a step of forming a laminated body by adhering the glass substratehaving the plurality of through holes on the resin layer. The glasssubstrate having the plurality of through holes has a thickness within arange of 0.05 mm to 0.3 mm.

Also, in one embodiment of the method according to the presentinvention, the glass substrate having the plurality of through holes maybe formed by irradiating laser light on a glass substrate.

In another embodiment, a maximum size of an opening of at least one ofthe through holes at a surface of the glass substrate on an oppositeside of the resin layer may be within a range of 5 μm to 100 μm.

In another embodiment, the plurality of through holes may be formed onthe glass substrate at a pitch within a range of 10 μm to 500 μm.

In another embodiment, the step of forming the resin layer may include astep of arranging a resin composition on the support substrate andsolidifying the resin composition.

In another embodiment, the resin layer may have release characteristicswith respect to the glass substrate.

In another embodiment, the resin layer may include at least one of acurable silicone resin and an acrylic resin that develops releasecharacteristics upon being irradiated with ultraviolet light.

In another embodiment, the method of the present invention may include astep of filling at least one of the through holes of the glass substratewith a conductive material.

In another embodiment, the method of the present invention may include astep of forming a conductive wiring pattern on a surface of the glasssubstrate on an opposite side of the resin layer, the conductive wiringpattern being electrically connected to the conductive material filledin the at least one of the through holes.

In another embodiment, the method of the present invention may include astep of separating the resin layer and the glass substrate from eachother.

According to another aspect of the present invention, an intermediateproduct for an interposer is provided that includes a glass substratehaving a plurality of through holes, a support substrate, and a resinlayer arranged between the support substrate and the glass substrate.The glass substrate has a thickness within a range of 0.05 mm to 0.3 mm.

Also, in one embodiment of the intermediate product according to thepresent invention, a maximum size of an opening of at least one of thethrough holes at a surface of the glass substrate on an opposite side ofthe resin layer may be within a range of 5 μm to 100 μm.

In another embodiment, the plurality of through holes may be formed onthe glass substrate at a pitch within a range of 10 μm to 500 μm.

In another embodiment, the resin layer may have release characteristicswith respect to the glass substrate.

In another embodiment, the resin layer may include at least one of acurable silicone resin and an acrylic resin that develops releasecharacteristics upon being irradiated with ultraviolet light.

In another embodiment, the resin layer may have a thickness within arange of 1 μm to 50 μm.

In another embodiment, the plurality of through holes of the glasssubstrate may be filled with a conductive material.

In another embodiment, the intermediate product according to the presentinvention may include a conductive wiring pattern that is arranged on asurface of the glass substrate on an opposite side of the resin layerand is electrically connected to at least one of the conductive materialfilled in the through holes.

In another embodiment, the support substrate may have a thickness withina range of 0.3 mm to 1.1 mm.

In another embodiment, the glass substrate may have a thermal expansioncoefficient within a range of 3×10⁻⁶/K to 1×10⁻⁵/K.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view of a first laminated bodyaccording to a first embodiment of the present invention;

FIG. 2 illustrates conventional process steps for forming a viaelectrode in a through hole of a glass substrate with through holes;

FIG. 3 illustrates process steps for forming a via electrode in athrough hole of a glass substrate with through holes using a laminatedbody according to an embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view of a second laminated bodyaccording to a second embodiment of the present invention;

FIG. 5 is a schematic cross-sectional view of a third laminated bodyaccording to a third embodiment of the present invention; and

FIG. 6 is a flowchart illustrating a method of manufacturing the thirdlaminated body according to an embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

First, terms used in the present description are defined below.

(Interposer)

In the present description, “interposer” refers to a glass substratehaving a through hole that is filled with a conductive material. In thepresent description, an “interposer” may also be referred to as “glasssubstrate with via electrode”.

(Glass Substrate with Through Holes)

In the present description, “glass substrate with through holes” refersto a glass substrate having a first surface and a second surfaceopposing each other and having at least one through hole penetratingthrough the first surface and the second surface.

When a conductive material is filled in a through hole of a “glasssubstrate with through holes”, the “glass substrate with through holes”becomes a “glass substrate with via electrode”, namely, an “interposer”.

(Intermediate Product for an Interposer)

In the present description, an “intermediate product for an interposer”(or simply “intermediate product”) collectively refers to a combinationof members including a “glass substrate with through holes” and othermembers. For example, a laminated body including a “glass substrate withthrough holes,” which is described in detail below, is a representativeexample of an “intermediate product for an interposer”.

Also, in the present description, for the sake of convenience, acombination of members including a “glass substrate with via electrode”,namely, an “interposer”, and other members may also be referred to as“intermediate product for an interposer”. In other words, a member onlymade up of a “glass substrate with via electrode” is referred to as“interposer”, whereas a combination of members including a “glasssubstrate with via electrode” and one or more other members is referredto as “intermediate product for an interposer”.

(Basic Concept)

In the following, a basic concept relating to the present invention isdescribed.

According to an aspect of the present invention, a laminated body isused in a process of manufacturing an interposer, the laminated bodyincluding a glass substrate having a plurality of through holes formedthereon, a support substrate, and a resin layer that is arranged betweenthe support substrate and the glass substrate.

As described above, when a glass substrate with through holes ismanufactured using a thin glass substrate, the strength of the glasssubstrate with through holes is decreased due to the thinness of theglass substrate and the existence of through holes in the glasssubstrate. Thus, the glass substrate with through holes may be prone tocracks and defects upon being handled in various processes and/or beingtransferred for a next process step, for example.

In view of the above, according to an aspect of the present invention, alaminated body including a glass substrate with through holes, a resinlayer, and a support substrate is used upon manufacturing an interposer.

By using such a laminated body, the strength of the glass substrate withthrough holes may be increased owing to the rigidity of the supportsubstrate. Thus, by using such a laminated body, the risk of cracks anddefects being created in the glass substrate with through holes upontransfer and/or handling in various processes may be reduced.

(First Laminated Body)

In the following, an intermediate product for an interposer according toan embodiment of the present invention is described with reference tothe accompanying drawings. Note that in the descriptions below, alaminated body is illustrated as an example of an intermediate productfor an interposer according to an embodiment of the present invention.

FIG. 1 is a schematic cross-sectional view of a first laminated body 100according to a first embodiment of the present invention.

As illustrated in FIG. 1, the first laminated body 100 according to thefirst embodiment includes a support substrate 110, a resin layer 120,and a glass substrate with through holes 130 stacked in this order.

The glass substrate with through holes 130 includes a glass substrate140 with a first surface 142 and a second surface 144 wherein aplurality of through holes 150 penetrating through the first surface 142and the second surface 144 are formed on the glass substrate 140.

The glass substrate 140 has a thickness in the range of 0.05 mm to 0.3mm.

The support substrate 110 has a greater rigidity than the glasssubstrate with through holes 130 and is capable of enhancing thestrength of the first laminated body 100.

The resin layer 120 is arranged on the second surface 144 of the glasssubstrate 140. The resin layer 120 binds the glass substrate withthrough holes 130 and the support substrate 110 together.

The strength of the first laminated body 100 having the configuration asillustrated in FIG. 1 may be substantially increased as compared withthe glass substrate with through holes 130 alone. Thus, by using thefirst laminated body 100, the risk of cracks and defects being createdin the glass substrate with through holes 130 upon transfer or handlingin various processes may be reduced, for example.

Note that the resin layer 120 of the first laminated body 100 preferablyhas “release characteristics” with respect to the glass substrate withthrough holes 130.

In the present description, “release characteristics” refers tocharacteristics of the resin layer 120 being easily separable from amember that is attached thereto (the glass substrate with through holes130 in the present case) without leaving a part of the resin layer 120remaining on the member.

Oftentimes, the support substrate 110 and the resin layer 120 includedin the laminated body 100 are unnecessary elements of an interposercorresponding to the final product. Thus, when the laminated body 100 isused, the glass substrate with through holes 130 may desirably beseparated from the resin layer 120 at their interface during a suitableprocess step before the interposer is provided as a final product.

In such a case, if the glass substrate with through holes 130 and theresin layer 120 are firmly bonded together, the resin layer 120 may notbe properly separated from the glass substrate with through holes 130,or defects such as cracking may occur in the glass substrate withthrough holes 130 upon separating the resin layer 120. For example, whena part of the resin layer 120 remains on the surface of the glasssubstrate with through holes 130, extra work may be required to removesuch residue.

However, if the resin layer 120 has release characteristics with respectto the glass substrate with through holes 130, the resin layer 120 maybe properly separated from the glass substrate with through holes 130and the above-described problem may be prevented.

Note that the resin layer 120 does not necessarily have to have suchrelease characteristics at all times. For example, the releasecharacteristics of the resin layer 120 may be arranged to develop rightbefore separating the resin layer 120 from the glass substrate withthrough holes 130. For example, some types of acrylic resin developrelease characteristics upon being irradiated with ultraviolet light. Byusing such acrylic resin as the resin layer 120, adequate adhesionbetween the glass substrate with through holes 130 and the resin layer120 may be secured while handling the laminated body 100 under normalcircumstances, and ultraviolet light may be irradiated on the resinlayer 120 at a suitable stage to separate the glass substrate withthrough holes 130 from the laminated body 100.

Also, in the first laminated body 100 having the configuration asillustrated in FIG. 1, because the second surface 144 of the glasssubstrate with through holes 130 is covered by the resin layer 120,defects such as voids may be prevented from being formed in a viaelectrode upon performing a process step of forming the via electrode byfilling the through hole 150 with conductive material, for example.

In the following, the above effect is described in greater detail withreference to FIGS. 2 and 3.

FIGS. 2 and 3 illustrate process steps for forming a via electrode byfilling a through hole of a glass substrate with conductive material ina plating process. FIG. 2 is a cross-sectional view of conventionalprocess steps for forming a via electrode in a glass substrate withthrough holes. FIG. 3 is a cross-sectional view of process steps forforming a via electrode in the glass substrate with through holes 130using the laminated body 100 having the configuration as illustrated inFIG. 1.

As illustrated in FIG. 2, in the conventional process steps for forminga via electrode in a glass substrate with through holes, first, a glasssubstrate 40 having a though hole 50 is prepared (see FIG. 2 (a)).

Then, a conductive layer is arranged on a first surface 42, a secondsurface 44, and the through hole 150 of the glass substrate 40 in anelectroless plating process (not shown).

Then, in an electrolytic plating process, a conductive material 55 isdeposited on regions of the glass substrate 40 where the conductivelayer has been formed. During the electrolytic plating process, anelectric field tends to be concentrated around the edges of the openingof the through hole 50 due to influences of the so-called “edge effect”.As a result, the conductive material 55 grows around the edges of theopening of the through hole 50 to protrude outward as illustrated inFIG. 2 (b).

As the plating process time is increased, this tendency becomes moreconspicuous. That is, growth of the plating layer may be concentratedaround the edges of the opening of the through hole 50 and the platinglayer may hardly be grown at a side face portion of the through hole 50(the side wall of the glass substrate 40). As a result, after a certaintime elapses, the opening of the through hole 50 may be closed by theconductive material 55 at the edges of the opening of the through hole50 even though the interior of the through hole 50 is not sufficientlyfilled with the conductive material 55 as illustrated in FIG. 2 (c).

In such a state, the plating solution cannot be adequately diffusedwithin the through hole 50. As a result, after the plating process iscompleted, a void 90 is created within the through hole 50 asillustrated in FIG. 2 (d).

Then, as illustrated in FIG. 2 (e), the conductive material 55 adheredto the first surface 42 and the second surface 44 of the glass substrate40 is removed to form a via electrode 60. However, the void 90 stillremains in the via electrode 60 such that a uniform via electrode 60cannot be created.

On the other hand, in the case of forming a via electrode by a platingprocess using the first laminated body 100 according to the firstembodiment, as illustrated in FIG. 3, the resin layer 120 is arranged onthe second surface 144 of the glass substrate 140.

In this way, influences of the above-described edge effect may besuppressed when a plating process is performed on the through hole 150.More specifically, as illustrated in FIG. 3 (b), the growth and outwardprotrusion of a conductive material 155 may be substantially suppressedat least at the second surface 144 of the glass substrate 140. Also,because influences of the edge effect are mitigated, uniform growth ofthe conductive material 155 within the through hole 150 may be promoted,and growth of the conductive material 155 at a side surface portion ofthe through hole 150 (the side wall of the glass substrate 140) may bepromoted.

Further, in general, a plating layer is more easily formed on thesurface of the resin layer 120 as compared to the surface of the glasssubstrate 140. Thus, by using the laminated body 100 including the resinlayer 120 arranged on the second surface 144 of the glass substrate 140,growth of the conductive material 155 from the second surface 144 sidemay be promoted within the through hole 150.

When the plating process is continued, as illustrated in FIG. 3 (c) toFIG. 3 (d), the through hole 150 may be filled up with the conductivematerial 155 before the opening at the first surface 142 of the glasssubstrate 140 is closed by a portion of the conductive material 155protruding at the edge of the opening.

Then, after the plating process is completed, and the conductivematerial 155 adhered to the first surface 142 and the second surface 144of the glass substrate 140 is removed, a via electrode 160 with lessvoids and defects may be formed within the through hole 150 asillustrated in FIG. 3 (e).

As can be appreciated from the above, by using the laminated body 100 inthe process step of forming a via electrode by filling the through hole150 with a conductive material, defects such as voids are less likely tobe created in the resulting via electrode.

(Second Laminated Body)

In the following, a laminated body according to another embodiment ofthe present invention is described with reference to FIG. 4.

FIG. 4 is a schematic cross-sectional view of a second laminated body200 according to a second embodiment of the present invention.

As illustrated in FIG. 4, the second laminated body 200 has aconfiguration basically similar to that of the laminated body 100 asillustrated in FIG. 1. Thus, in FIG. 4, elements corresponding to thoseillustrated in FIG. 1 are given reference numerals equal to 100 morethan the reference numerals of the corresponding elements in FIG. 1.

Note, however, that in contrast to the first laminated body 100, thesecond laminated body 200 includes via electrodes 260 that are formed byfilling a conductive material in through holes 250 of a glass substratewith through-holes 230. Thus, the glass substrate with through-holes 230of the laminated body 200 also constitutes a glass substrate with viaelectrodes 230. Note that the type of conductive material filled in thethrough holes 250 is not particularly limited.

In the second laminated body 200 having the above-describedconfiguration, effects similar to those obtained in the first laminatedbody 100 as described above may be obtained. For example, the risk ofcracks and other defects being created in the glass substrate withthrough-holes 230 (glass substrate with via electrodes 230) may bereduced during transfer and/or handling of the laminated body 200 invarious processes.

(Third Laminated Body)

In the following, a laminated body according to another embodiment ofthe present invention is described with reference to FIG. 5.

FIG. 5 is a schematic cross-sectional view of a third laminated bodyaccording to a third embodiment of the present invention.

As illustrated in FIG. 5, the third laminated body 300 has aconfiguration basically similar to that of the laminated body 200illustrated in FIG. 4. Thus, in FIG. 5, elements corresponding to thoseof FIG. 4 are given reference numerals that are equal to 100 more thanthe reference numerals of the corresponding elements in FIG. 4.

Note, however, that in contrast to the second laminated body 200, thethird laminated body 300 includes a conductive wiring pattern 370arranged on top of a glass substrate with via electrodes 330.

The conductive wiring pattern 370 includes an insulating layer 375 and aconductive wiring portion 380 formed inside and on the surface of theinsulating layer 375. A part of the conductive wiring portion 380 may beelectrically connected to via electrodes 360 of the glass substrate withvia electrodes 330.

In the third laminated body 300 having the above-describedconfiguration, effects substantially similar to those obtained in thefirst laminated body 100 and the second laminated body 200 as describedabove may be obtained. For example, the risk of cracks and other defectsbeing created in the glass substrate with through-holes 330 (glasssubstrate with via electrodes 330) may be reduced during transfer and/orhandling of the laminated body 300 in various processes.

(Component Members of Laminated Body)

In the following, component members of the laminated body are describedin greater detail.

Note that although component members of the third laminated body 300 asillustrated in FIG. 5 are described as an example below, the firstlaminated body 100 and the second laminated body 200 may be made ofsimilar component members.

(Support Substrate 310)

The support substrate 310 is a member for supporting the resin layer 320and the glass substrate with through holes 330 (or glass substrate withvia electrodes 330) arranged thereon. The support substrate 310 providesrigidity to the laminated body 300, and in this way, the strength of thelaminated body 300 may be increased.

The material of the support substrate 310 is not particularly limited.

For example, the support substrate 310 may be made of a metal such asstainless steel or copper. Alternatively, the support substrate 310 maybe made of glass such as alkali-free glass or soda lime glass, forexample. Alternatively, the support substrate 310 may be made of glassepoxy resin or plastic (synthetic resin), for example. Examples ofplastic materials include, but are not limited to, polyethyleneterephthalate resin, polycarbonate resin, polyimide resin, fluorineresin, polyamide resin, aromatic polyamide resin, polyamide-imide resin,polyether sulfone resin, polyether ketone resin, polyether ketone ketoneresin, polyether ether ketone resin, polyethylene naphthalate resin,polyacrylic resin, various liquid crystal polymer resins, and siliconeresin.

Note that when a heating process has to be performed on the laminatedbody 300 in the interposer manufacturing process, the support substrate310 preferably has heat resistance.

The thickness of the support substrate 310 is not particularly limitedbut may be in the range of 0.3 mm to 1.1 mm, for example. Note that ifthe thickness of the supporting substrate 310 is too thin, the supportsubstrate 310 may be unable to provide adequate rigidity to thelaminated body 300.

(Resin Layer 320)

The resin layer 320 binds together the support substrate 310 and theglass substrate with through holes 330.

The resin layer 320 may be made of curable silicone resin and/or acrylicresin, for example, but is not limited thereto.

As described above, the resin layer 320 preferably has releasecharacteristics with respect to the glass substrate with through holes330. In this way, the portion of the laminated body 300 including theglass substrate with through holes 330 and the conductive wiring pattern370 may be easily separated from the portion of the laminated body 300including the resin layer 320 and the support substrate 310 at asuitable stage.

An example of a resin composition having such release characteristicsincludes the resin composition disclosed in Japanese Laid-Open PatentPublication No. 2011-46174 (curable silicone resin composition includingorgano alkenyl polysiloxane and organohydrogen polysiloxane having ahydrogen atom bonded to a molecular end of a silicon atom). Also, sometypes of acrylic resin develop release characteristics upon beingirradiated with ultraviolet light.

Note that the adhesion between the support substrate 310 and the resinlayer 320 is preferably greater than the adhesion between the resinlayer 320 and the glass substrate with through holes 330. In this way,the resin layer 320 may be prevented from being separated from thesupport substrate 310 at their interface upon separating the resin layer320 from the glass substrate with through holes 330. Thus, the portionof the laminated body 300 including the glass substrate with throughholes 330 and the conductive wiring pattern 370 may be separated fromthe portion of the laminated body 300 including the resin layer 320 andthe support substrate 310.

The thickness of the resin layer 320 is not particularly limited. Forexample, the thickness of the resin layer 320 may be in the range of 1μm to 50 μm.

(Glass Substrate with Through Holes 330)

The glass substrate 340 for the glass substrate with through-holes 330may be made of any type of glass such as soda lime glass or alkali-freeglass, for example.

However, assuming through holes are to be formed in the glass substrate340 through laser processing, the thermal expansion coefficient of theglass substrate 340 is preferably in the range of 3×10⁻⁶/K to 1×10⁻⁵/K.In this way, the glass substrate 340 may be substantially prevented fromchipping and/or cracking when laser processing is performed thereon.

The glass substrate with through holes 330 has a thickness in the rangeof 0.05 mm to 0.3 mm.

The through holes 350 may be formed in the glass substrate 340 in anynumber, size, shape, and pitch.

For example, the shape of the through holes 350 may be substantiallycylindrical, substantially elliptical, or have a substantially prismaticshape. Also, the through holes 350 may be tapered from the first surface342 toward the second surface 344 of the glass substrate 340.

Also, the maximum size of the through holes 350 at the first surface 342or the second surface 344 of the glass substrate 340 (i.e. openingportions) may be in the range of 5 μm to 100 μm, for example. Note thatthe above maximum size may refer to the diameter or the long diameter ofthe openings of the through holes 350 in the case where the throughholes 350 are substantially cylindrical or substantially elliptical.

Also, the through holes 350 may be arranged at a pitch of 10 μm to 500μm in the glass substrate 340, for example.

(Via Electrode 360)

The material of the via electrodes 360 formed in the through holes 350is not particularly limited as long as it is a conductive material. Forexample, the via electrodes 360 may be made of zinc, a zinc alloy,nickel, a nickel alloy, copper, or a copper alloy. As described below,the via electrodes 360 may be formed in the through holes 350 by aplating process.

(Conductive Wiring Pattern 370)

The conductive wiring pattern 370 is arranged on top of the firstsurface 342 of the glass substrate 340.

For example, the conductive wiring pattern 370 may include an insulatinglayer 375 and a conductive wiring portion 380 formed inside and on thesurface of the insulating layer 375.

The insulating layer 375 may be made of resin, for example, but is notlimited thereto. The conductive wiring portion 380 may be made of aconductive metal material such as copper, for example. At least a partof the conductive wiring portion 380 may be electrically connected tothe via electrodes 360 of the glass substrate with via electrodes 330.

(Method of Manufacturing Laminated Body)

In the following a method of manufacturing a laminated body according toanother embodiment of the present invention is described with referenceto the drawings.

Note that a method of manufacturing the third laminated body 300 asillustrated in FIG. 5 is described below as an illustrative example.Accordingly, reference numerals indicated in FIG. 5 are used below.However, note that similar process steps may be implemented tomanufacture the first laminated body 100 and the second laminated body200.

FIG. 6 is a flowchart illustrating process steps of a method ofmanufacturing a laminated body according to an embodiment of the presentinvention.

As illustrated in FIG. 6, the method of manufacturing a laminated bodyaccording to the present embodiment includes:

a step of forming a resin layer on a support substrate (step S110);

a step of adhering a glass substrate having a plurality of holes andhaving a thickness of 0.05 mm to 0.3 mm on the resin layer to form alaminated body (step S120);

a step of filling at least one of the through holes of the glasssubstrate with a conductive material (step S130); and

a step of forming, on a surface of the glass substrate on the oppositeside of the resin layer, a conductive wiring pattern that iselectrically connected to the conductive material filled in the throughhole (step S140).

In a method of manufacturing a laminated body according to anotherembodiment, if necessary or desired, the method may further include:

a step of separating the resin layer and the glass substrate from eachother (step S150).

Note that a glass substrate with via electrodes having a conductivematerial filled in its through holes may have a greater strength than aglass substrate with through holes that does not have the conductivematerial filled therein. Accordingly, in some cases, the glass substratewith via electrodes may not be susceptible to cracking and defects evenwhen the glass substrate with via electrodes is transferred alone orhandled alone in various process steps, for example. In such a case, theexecution order of step S140 and step S150 may be reverse, for example.

In the following, the above process steps are described in greaterdetail.

(Step S110)

First, the resin layer 320 is formed on the support substrate 310.

Note that the method of forming the resin layer 320 on the supportsubstrate 310 is not particularly limited. For example, the resin layer320 may be formed by arranging a liquid or non-liquid resin compositionon the support substrate 310 and solidifying the resin composition.

The resin composition may contain an organic solvent as is necessary ordesired.

Exemplary methods for arranging the resin composition on the supportsubstrate 310 include spray coating, die coating, spin coating, dipcoating, roll coating, bar coating, screen printing, and gravurecoating.

Note that the method for solidifying the resin composition is notparticularly limited. For example, the resin composition may besolidified by a heating process and/or an ultraviolet light irradiationprocess.

For example, in a case where a curable silicone resin is used as theresin layer 320, the above-described resin composition (curable siliconeresin composition including organo alkenyl polysiloxane andorganohydrogen polysiloxane having a hydrogen atom bonded to a molecularend of a silicon atom) may be coated on the support substrate 310 afterwhich the resin composition may be maintained in the atmosphere under atemperature of 50° C. to 300° C. to solidify the resin composition.

Note that the adhesion between the support substrate 310 and the resinlayer 320 is preferably arranged to be relatively high such that whenseparating the glass substrate with through holes 330 from the laminatedbody 300 in a subsequent step (step S150), the support substrate 310 andthe resin layer 320 may be prevented from separating at their interface.

Accordingly, in some embodiments, before arranging the resin compositionon the support substrate 310, a surface modification process may beperformed on the surface of the support substrate 310. Examples of thesurface modification process include a chemical process such as a primerprocess for improving chemical bonding using a silane coupling agent,for example, a physical process such as a flame treatment for increasingthe surface active group, and an a mechanical process such assandblasting for increasing the roughness of the surface to promote thedevelopment of the wedge effect, for example.

Also, as described above, the resin layer 320 is preferably arranged tohave release characteristics at its interface with the glass substratewith through holes 330 to be arranged in a subsequent step (step S120).In this way, in the step of separating the glass substrate with throughholes 330 of the laminated body 300 (step S150), the glass substratewith through holes 330 and the resin layer 320 may be easily separatedfrom each other at their interface.

(Step S120)

Then, the glass substrate with through holes 330 is arranged on theresin layer 320 that has been formed in step S110, and the laminatedbody 300 is formed.

The glass substrate with through holes 330 is prepared by forming aplurality of through holes 350 in the glass substrate 340.

The method for forming the through holes 350 is not particularlylimited. For example, the through holes 350 may be formed in the glasssubstrate 340 by irradiating laser light such as an excimer laser havinga suitable energy on the glass substrate 340. Alternatively, the throughholes 350 may be formed by a laser-guided discharge process, forexample.

As described above, the number, size, shape, and pitch of the throughholes 350 are not particularly limited. For example, the shape of thethrough holes 350 may be substantially cylindrical, substantiallyelliptical, or may have a substantially prismatic shape. Also, thethrough holes 350 may be tapered from the first surface 342 toward thesecond surface 344 of the glass substrate 340.

The method of bonding the glass substrate with through holes 330 to theresin layer 320 is not particularly limited. For example, afterarranging the glass substrate with through holes 330 on the resin layer320, the two members may be pressure bonded using a roll or a press, forexample. Alternatively, after arranging the glass substrate with throughholes 330 on the resin layer 320, the members may be placed in apressure chamber and bonded together by a non-contact bonding process,for example. Note that other various processes may be used to bond theglass substrate with through holes 330 and the resin layer 320.

By performing the above steps, a laminated body including the supportsubstrate 310, the resin layer 320, and the glass substrate with throughholes 330 may be formed.

For example, the first laminated body 100 as illustrated in FIG. 1 maybe manufactured by the above steps.

(Step S130)

In the case of manufacturing the third laminated body 300 (and thesecond laminated body 200), at least one through hole 350 of the glasssubstrate with through holes 330 is filled with a conductive material toform a via electrode 360.

Note that the type of conductive material used in the via electrode 360is not particularly limited. For example, the conductive material may benickel, a nickel alloy, copper, a copper alloy, zinc, or a zinc alloy.

Also, the method of forming the via electrode 360 is not particularlylimited.

For example, the via electrode 360 may be formed by filling the throughhole 350 with a conductive material in a plating process.

For example, in a case where copper is used as the conductive materialand the through hole 350 is filled with copper in a plating process, thefollowing process steps may be implemented.

(First Process)

First, a copper electroless plating process is performed to form anelectroless copper plating film on the first surface 342 of the glasssubstrate 340 and the side wall of the through hole 350.

(Second Process)

Then, a copper electrolytic plating process is performed to form acopper electroplating layer on the copper electroless plating filmformed in the first process.

In this way, the through hole 350 may be filled with copper and the viaelectrode 360 may be formed.

Note that in a laminated body according to an embodiment of the presentinvention, the second surface 344 of the glass substrate with throughholes 330 is covered by the resin layer 320. Thus, as described above,influences of the edge effect may be mitigated upon forming the viaelectrode 360 by a plating process, and the via electrode 360 may beformed with less voids and defects (see FIG. 3).

(Step S140)

Then, a desired conductive wiring pattern 370 is formed on the glasssubstrate with through holes 330.

The method of forming the conductive wiring pattern 370 is notparticularly limited, and various conventional methods may be used. Forexample, the conductive wiring pattern 370 may be formed by patterningan insulating layer on top of the glass substrate with through holes 330via a mask and depositing a conductive material at desired positionsthereafter. In another example, the conductive wiring pattern 370 may beformed by repeatedly performing the processes of depositing andpartially etching an insulating film and depositing and partiallyetching a conductive material, for example, to form the conductivewiring portion 380 inside and/or on the surface of the insulating layer375.

By performing the above steps, the third laminated body 300 asillustrated in FIG. 5 may be manufactured.

(Step S150)

Then, if necessary or desired, the glass substrate with through holes330 and the resin layer 320 may be separated from each other at theirinterface.

In this way, an intermediate product for an interposer including theglass substrate with through holes 330 and the conductive wiring pattern370 formed thereon may be manufactured.

The above-described method of manufacturing a laminated body does notinclude a step of transferring or handling the relatively fragile glasssubstrate with through holes 330 alone. Accordingly, the risk of cracksand defects being created in the glass substrate may be reduced inmanufacturing a laminated body or an intermediate product for aninterposer that is ultimately obtained, for example.

Aspects of the present invention may be applied, for example, to aninterposer that may be used in semiconductor 3D packaging technology.

Although the present invention has been described above with respect toillustrative embodiments, the present invention is not limited to theseembodiments and various variations and modifications may be made withoutdeparting from the scope of the present invention.

What is claimed is:
 1. A method of manufacturing an intermediate productfor an interposer including a glass substrate having a plurality ofthrough holes, the method comprising: a step of forming a resin layer ona support substrate; and a step of forming a laminated body by adheringthe glass substrate having the plurality of through holes on the resinlayer, the glass substrate having the plurality of through holes havinga thickness within a range of 0.05 mm to 0.3 mm.
 2. The method accordingto claim 1, wherein the glass substrate having the plurality of throughholes is formed by irradiating laser light on a glass substrate.
 3. Themethod according to claim 1, wherein a maximum size of an opening of atleast one of the through holes at a surface of the glass substrate on anopposite side of the resin layer is within a range of 5 μm to 100 μm. 4.The method according to claim 1, wherein the plurality of through holesare formed on the glass substrate at a pitch within a range of 10 μm to500 μm.
 5. The method according to claim 1, wherein the step of formingthe resin layer includes a step of arranging a resin composition on thesupport substrate and solidifying the resin composition.
 6. The methodaccording to claim 1, wherein the resin layer has releasecharacteristics with respect to the glass substrate.
 7. The methodaccording to claim 1, wherein the resin layer includes at least one of acurable silicone resin and an acrylic resin that develops releasecharacteristics upon being irradiated with ultraviolet light.
 8. Themethod according to claim 1, further comprising: a step of filling atleast one of the through holes of the glass substrate with a conductivematerial.
 9. The method according to claim 8, further comprising: a stepof forming a conductive wiring pattern on a surface of the glasssubstrate on an opposite side of the resin layer, the conductive wiringpattern being electrically connected to the conductive material filledin the at least one of the through holes.
 10. The method according toclaim 8, further comprising: a step of separating the resin layer andthe glass substrate from each other.
 11. An intermediate product for aninterposer comprising: a glass substrate having a plurality of throughholes; a support substrate; and a resin layer arranged between thesupport substrate and the glass substrate; wherein the glass substratehas a thickness within a range of 0.05 mm to 0.3 mm.
 12. Theintermediate product according to claim 11, wherein a maximum size of anopening of at least one of the through holes at a surface of the glasssubstrate on an opposite side of the resin layer is within a range of 5μm to 100 μm.
 13. The intermediate product according to claim 11,wherein the plurality of through holes are formed on the glass substrateat a pitch within a range of 10 μm to 500 μm.
 14. The intermediateproduct according to claim 11, wherein the resin layer has releasecharacteristics with respect to the glass substrate.
 15. Theintermediate product according to claim 11, wherein the resin layerincludes at least one of a curable silicone resin and an acrylic resinthat develops release characteristics upon being irradiated withultraviolet light.
 16. The intermediate product according to claim 11,wherein the resin layer has a thickness within a range of 1 μm to 50 μm.17. The intermediate product according to claim 11, wherein theplurality of through holes of the glass substrate are filled with aconductive material.
 18. The intermediate product according to claim 17,further comprising: a conductive wiring pattern that is arranged on asurface of the glass substrate on an opposite side of the resin layerand is electrically connected to at least one of the conductive materialfilled in the through holes.
 19. The intermediate product according toclaim 11, wherein the support substrate has a thickness within a rangeof 0.3 mm to 1.1 mm.
 20. The intermediate product according to claim 11,wherein the glass substrate has a thermal expansion coefficient within arange of 3×10⁻⁶/K to 1×10⁻⁵/K.